That's better than a bag.
This is exactly why I said that Canon test engineers never signed R5 off for production. Management must have simply walked over them in a rush to release mirrorless FF cameras which have a "killer" feature nobody else can match. In this case it apparently kills just the R5 GPU instead of competition.I have to wonder if they actually have done thermal analysis (like using a FLIR to look at the R5) to figure out if what looks like the back of the LCD is used to dump the heat out of the camera body. If it is fairly heat insulating as a design that little heatsink+fan won't help that much since it won't be able to move any of the internal heat out.
I think those guys believe that the R5 is like the E-M1II/III's thermal solution where it is heatsinked to the back. Also below is the E-M1X which you can see the huge beefy heatsinking section and an E-M10 which is plastic bodied and doesn't have the chassis heatsink or at least anything beyond that copper plate from what I can tell. Also added an EOS R as well, for reference since I was able to find an image of one.Unless the plastic used on R5 beneath the flippy screen is porus how would it cool the innard
Plastic is the problem here. Even when modern ILC:s use chunky magnesium bodies which would dissipate heat nicely assuming that latent heat is first transferred from the chipset to chassis, the whole thing is wrapped inside a tight plastic cover which is a pretty good insulator.Just searched for that IG account. Unless the plastic used on R5 beneath the flippy screen is porus how would it cool the innards
For reference, the A7RII used to hit around surface temperatures of 100F before shutdown and 110F after the firmware allowed it to go for longer as for the purposes of video recording. Some Sony did creative things like putting on fans pointed at the back, adding a heatsink to the back or outright pulled the LCD out to prolong the recording capabilities:Unfortunately I'm pretty sure that even camera chipsets still generate so much heat under such load that full metal bodies would pretty soon become so hot that nobody could hold them without a pair of complimentary "CANON R5"-banded oven mittens. So it's better to cover bodies with plastic which kill the chipset instead of actually scalding users.
That's funny, sort of. I remember badly wanting a good point and shoot cam with 1080P video. That seems like a life time ago. In all honesty, for my very modest use case, I miss my Panasonic video camera. Shot wonderful footage with something like 50x zoom. No bigger than a mid-sized lens.Remember the olden days when you had one camera for shooting stills, and another purpose-built affair for shooting video?
We already know the answer. It’s the Panasonic S1H. Using a non-crop, OS4k or 8k using existing uncompressed codecs is going to require a fan equivalent to the S1H at a minimum, and a larger body. Even a RED at 6k has heating issues contributing their unreliability.This is exactly why I said that Canon test engineers never signed R5 off for production. Management must have simply walked over them in a rush to release mirrorless FF cameras which have a "killer" feature nobody else can match. In this case it apparently kills just the R5 GPU instead of competition.
If Canon R5 has a chipset that is capable of recording 8k video for 5 minutes, then it's also capable of recording 8k for 5 of 15 hours straight if only thermal management is designed properly. And thermal management is definitely not a rocket science.
GPU designers tell you precisely what kind of heatsink is required to keep the GPU running at even 100% load forever without any thermal limitations. It was a mangement decision to intentionally launch R5 with insufficient heat transfer. They just decided that it's more important to save few grams of weight and $10 of production cost.